Hitachi, Ltd. (TSE: 6501) today announced, as an industry first, the HM5225645FBP-B60 (x64-
bit configuration) and HM5225325FBP-B60 (x32-bit configuration) Multi-Chip Package*1 256-
Mbit synchronous DRAMs (SDRAMs), with four 64-Mbit SDRAMs mounted on a single BGA 
package base, for use as main memory in notebook PCs and portable information devices.  
Sample shipments will begin in June 1999 in Japan.

These new products offer the industry's first single-package implementation of 256-Mbit capacity 
in x64-bit and x32-bit configurations, and are almost the same size as current 64-Mbit SDRAM 
packages, enabling systems to be made more compact.

Notebook PCs and portable information devices are not only improving in terms of performance 
and functionality, but are also becoming smaller and lighter, requiring system implementation 
within a very limited space.  Providing a main memory capacity of 32 or 64 Mbytes for such 
products has required the use of four or eight x16-bit configuration  64-Mbit SDRAMs.  
However, a greater degree of SDRAM density will be needed in the future to meet the demands of 
larger main memory capacities and smaller system size.

To meet this need, Hitachi developed the HM5225645FBP-B60 (x64-bit configuration) and 
HM5225325FBP-B60 (x32-bit configuration) 256-Mbit SDRAMs, offering x64 and x32 multi-bit 
implementation together with large capacity, through the use of the company's proprietary Multi-
Chip Package.

The new products use Hitachi 64-Mbit SDRAMs with a small 38 mm2 chip size, and by employing 
KGD technology*2 to improve productivity plus COB*3 technology to enable four chips to be 
mounted on a single base, offer both a multi-bit configuration and large capacity in a single 
package.  Four x16-bit 64-Mbit SDRAMs are used in the x64-bit configuration HM5225645FBP-
B60, and four x8-bit 64-Mbit SDRAMs in the x32-bit configuration HM5225325FBP-B60.

This makes it possible to provide 32-Mbyte memory capacity in a single package for systems with 
a 64- or 32-bit memory bus width.  This is useful when space for memory expansion is limited.

These new products use existing 64-Mbit SDRAM chips, providing compatibility with standard 
64-Mbit SDRAMs and easy replacement in memory systems.  For example, features such as 
PC100 specifications and 4k/64 ms refreshing can be supported in the same way as when using 
current 64-Mbit SDRAMs.

Instead of the TSOP packages of previous 64-Mbit SDRAMs, a standard BGA package is used.  
The pin pitch (ball pitch) is 1.27 mm, simplifying on-board wiring design.  The package has a pin 
count of 108, and the layout follows Hitachi's original specification.  The package size is 22.0 mm 
x 14.0 mm, almost the same as current 64-Mbit SDRAMs.  The power supply voltage is 3.3 V, 
conforming to the PC100 specification.

These new SDRAMs can be used effectively in a variety of non-PC fields, including digital still 
cameras and copiers, as well as in notebook PCs and portable information devices.

Future plans include the development of  the 128-Mbit models with a x32-bit configuration and  
also the Multi-Chip Package 256-Mbit SDRAM of a 2.5V external voltage version  according to a 
development of the 64-Mbit chips of a 2.5V external voltage version. 

Notes:	1.Multi-Chip Package: A package in which a number of semiconductor chips, etc., 
           are mounted.
	2.KGD: Known-Good-Die.  KGD technology uses chip testing to provide good-
           quality chips.  
	3.COB: Chip-On-Board.  An assembly technique in which a chip is mounted directly 
           on the board.

< Typical Applications >
-Main memory in notebook PCs, portable information devices, etc.
- Memory in non-PC fields such as digital still cameras and copiers

< Prices in Japan > (For Reference Only)
Product Code		Configuration	Refreshing	Sample Price (Yen)
HM5225645FBP-B60        4M x 64         4k/64ms         30,000
HM5225325FBP-B60        8M x 32         4k/64ms         30,000

< Specifications >
Product code                 HM5225645FBP-B60/ HM5225325FBP-B60    
Configuration                1M x 64 x 4 banks / 2M x 32 x 4 banks 
Base chip (64-Mbit SDRAM)                                                     
configuration                1M x 16 x 4 banks / 2M x 8 x 4 banks  
Number of chips mounted      4                                     
Power supply voltage         Single 3.3 V power supply (±0.3 V)    
Performance                  PC100 (100 MHz) support               
Type/functions               64-Mbit SDRAM compatibility           
Refresh specification        4k/64ms                               
Package                      Standard BGA (108 pins, 1.27 mm pitch)