Hitachi,Ltd. (TSE: 6501) today announced the industry's first large capacity  memory modules, 
256-Mbyte 144-pin Small Outline DIMM (SO DIMM) using 64-Mbit synchronous 
DRAM(SDRAM) for Notebook personal computers.  Hitachi is now commercially releasing the  
HB52RD328DC and starts the sample shipment  on June 21, 1999 in Japan. 
This new product achieves large capacity in SO DIMM by using the industry's smallest production 
level chip size, 38mm2, 64-Mbit SDRAM and using Hitachi TCP stack mounting technology. 
Moreover, this product supports 100MHz high-speed operation (PC 100).

Along with the recent trends towards increased performance in personal computers and increased 
sizes in PC applications, the memory capacity installed in current PCs is also increasing.  
Meanwhile, as represented by notebook personal computers, the space allocated for this 
equipment is getting smaller every year, and the number of sockets to hold memory modules is 
limited.  Therefore, memory module are being requested higher density.
Hitachi already developed and is mass producing the 128-Mbyte 144-pin SO DIMM using Hitachi 
TCP stack mounting technology that mounts 64-Mbit SDRAM TCP packages in two layers . 
This time, responding to the need of larger capacity, Hitachi has developed the 256-Mbyte 144-pin 
SO DIMM, HB52RD328DC, that has four times large capacity of the 144-pin SO DIMM using 
TSOP type 64-Mbit SDRAM. This new product employs the industry's smallest level chip size, 
38mm2, 64-Mbit SDRAM and achieved 256-Mbyte  capacity which was not available in existing 
144-pin SO DIMM using TSOP type 64-Mbit SDRAM.
The product is a 3.3-V power-supply voltage product and supports 100MHz high-speed operation 
(PC 100).  This product has a 32M x 64-bit (2 bank) memory organization and is an unbuffered 
type for use in PCs.  It is a 144-pin SO DIMM with external dimensions of 67.6 x 31.75 x 3.80mm 
that conform to the JEDEC standards. 

Future plans include the development of 256-Mbyte144-pin SO DIMM which supports 133MHz 
operation (PC133).


< Application examples >
     Notebook PCs
     (supports 64-bit data bus and PC100)

< Prices in Japan (For Reference Only) >
Product Code		CAS latency	Sample Price (Yen)
HB52RD328DC-A6F		2/3		120,000           
HB52RD328DC-B6F		3		120,000           

< Specifications >
Item				HB52RD328DC-A6F			HB52RD328DC-B6F          
Bit organization		32M x 64                        32M x 64                 
Bank organization		2 banks				2 banks                  
Mounted SDRAM specification	4M x 4 x 4 banks		4M x 4 x 4 banks
				32 SDRAMs			32 SDRAMs                
Register			No				No                       
Capacity			256-Mbytes			256-Mbytes                           
Supported memory bus		PC100				PC100                    
CAS latency			2/3				3                        
External dimensions		144-pin SO DIMM			144-pin SO DIMM          
                                                         67.6mm x 31.75mm x 3.80mm	       67.6mm x 31.75mm x 3.80mm