REDONDO BEACH, CALIF. -- May 22, 2001; TOKYO, JAPAN - May 23, 2001
- Hitachi, Ltd. (NYSE:HIT) and TRW's (NYSE.TRW) new semiconductor
company, Velocium, have signed a joint development agreement to design
and develop very high efficiency power amplifier modules for 3G wireless
handsets and other wireless devices. Hitachi, the world leader in
power amplifier modules for cell phones, will manufacture the modules
using Velocium's technology leading indium phosphide (InP) semiconductors.
The new power amplifiers are integral to the development of wideband
CDMA (W-CDMA) handsets for 3G, the next generation of wireless communications
enabling Internet access, high-speed data communications and other
high-data-rate applications. According to Gartner Dataquest, shipments
of wireless handsets will exceed 700 million units by 2005. 3G is
estimated to capture nearly 10 percent of these shipments.
InP is an advanced compound semiconductor that offers a number of
performance improvements over currently available semiconductors for
power amplification in mobile handsets. These performance improvements
result in excellent power efficiency of more than 50 percent and provide
the signal quality improvements needed for W-CDMA applications. Together
with Hitachi's module technologies, this will translate to a higher
performance, cost-competitive power module. For consumers, this capability
means longer talk-time and improved service quality.
TRW is extremely pleased to be joining forces with Hitachi,
a very successful market leader for handset components, in the development
of power amplifier modules for the 3G wireless market, said
Dwight Streit, Velocium's president. Their manufacturing capability,
coupled with our advanced InP technology, will enable the volume manufacture
of wireless handsets with talk times and performance never before
Velocium provides us with InP technology that will enhance the
leadership position of the Hitachi power amplifier modules,
said Hideo Inayoshi, senior group executive, System Solution Division,
Semiconductor & Integrated Circuits Group of Hitachi. Combining
our modules with Velocium's technology will realize high performance
and reduce cost.
Both companies will participate in the design and development of the
modules, contributing existing proprietary designs and developing
new designs. The first InP-based power amplifier modules should be
available for handset OEM sampling early next year. TRW's substantial
investments in high-volume InP production and Hitachi's sophisticated
module design and manufacturing capability will assure the availability
and power amplifier module performance OEMs need for volume production
of 3G handset in the second half of 2002.
Velocium is located in Manhattan Beach, CA. TRW Inc. provides advanced
technology products and services for the global aerospace, telecommunications,
information systems and automotive markets. TRW and Velocium news
releases are available on the corporate Web site: http://www.trw.com.
Hitachi, Ltd., headquartered in Tokyo, Japan, is one of the world's
leading global electronics companies, with fiscal 2000 (ended March
31, 2001) consolidated sales of 8,417 billion yen ($67.9 billion*).
The company manufactures and markets a wide range of products, including
computers, semiconductors, consumer products and power and industrial
equipment. For more information on Hitachi, Ltd., please visit Hitachi's
Web site at http://global.hitachi.com.
* At an exchange rate of 124 yen to the dollar.