Tokyo, July 30, 2001-- Hitachi, Ltd. (TSE: 6501) today announced
the HZN6.8ZMFA surge absorption zener diode for the protection of
the internal circuitry of small portable equipments such as mobile
phones and PDAs from external surge voltages. The HZN6.8ZMFA is housed
in the ultra-thin small package VSON-5 (Hitachi package code). Sample
shipments start on July 31, 2001 in Japan.
This product features 4 devices in the newly-developed VSON-5 package
of 1.6mm × 1.6mm(typ.), which provides savings of approximately
40% over its previous CMPAK-5 (Hitachi package code) in terms of mounting
area and thickness. While the capacitance is small of 25pF max., it
offers a high static surge rating of 25KV min. (IEC61000-4-2, Contact
Discharge Test) meaning smaller equipments and circuit protection
Small portable equipments such as mobile phones and PDAs are equipped
with terminals for connection to other devices. However, surge voltages
due to static, etc., from those terminals can even destroy the internal
circuitry. Therefore, it is normal to use surge absorbing zener diodes
inside terminals to protect the internal circuitry. Hitachi's lineup
of zener diodes for absorbing surge includes products falling into
two categories: low-capacitance types, which are ideal for protecting
high-speed signal lines, and high surge rating products, which are
ideal for power lines, which require a high surge rating.
In response to today's demand for increased miniaturization and slimmer
profiles of equipment requiring high-density mounting of devices,
Hitachi has developed the new HZN6.8ZMFA, which features the VSON-5
package, which, measuring 1.6mm × 1.6mm (typ.) and with a thickness
of just 0.6mm (max.) is yet smaller and slimmer than its previous
package in mass production, the CMPAK-5, which measures 2.0mm ×
2.1mm (typ.) and has a thickness of 1.0mm (max.).
[About this Product]
The zener voltage of HZN6.8ZMFA is 6.47V to 7.00V and this product
houses 4 devices in one package. By reducing the chip thickness, it
has been possible to use the newly-developed VSON-5 pakage, providing
40% savings over the CMPAK-5 in terms of both surface mounting area
and product thickness. This, in turn, allows the equipment to be smaller
The HZN6.8ZMFA provides both low capacitance (less than 25pF at VR=0V
and less than 10pF at VR=5V) and high surge rating (25KV min. as defined
in IEC61000-4-2, Contact Discharge), improving system
This product is available in embossed taping format, which is ideal
for automatic mounting.
In future, Hitachi is to develop a single-device UFP package (Hitachi
package code. External size: 1.6mm × 0.8mm (typ.)), providing
increased mounting freedom.
< Typical Applications >
Small portable equipment such as mobile phones, notebook PCs, PDAs,
digital still cameras, etc.
< Prices in Japan > (For Reference)
< Specifications >