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|Hitachi Releases SH7294 for Next-Generation Mobile
Phones with Built-In Camera
as Second-Phase Product in SuperHTM Mobile Application Processors SH-Mobile Series
|- VGA camera connection and versatile screen display capabilities through enhanced camera support functions -|
Tokyo, June 25, 2002 Hitachi, Ltd. (TSE: 6501) today announced the SH7294, featuring enhanced functions for next-generation mobile phones with a built-in camera, as the second-phase product in the SH-Mobile (SuperHTM*1 Mobile Application Processor) Series for next-generation mobile phone system. Sample shipments will begin in July 2002 in Japan. Also announced the HJ93D1705BP Multi Chip Modules (MCMs) incorporating a stack-mounted SH7294 and 1-Mbyte SRAM, with sample shipments also beginning in July 2002 in Japan.
The SH7294 is a processor that is connected to the baseband LSI of a mobile phone system and performs dedicated processing of multimedia applications, such as audio and moving pictures applications. The SH7294 is a compact version removing RAM and some peripheral functions including USB from the first-phase product SH7290. but on the other side, it incorporates a featuring enhanced camera-support and display functions that make it suitable for use in mobile phones with a built-in camera. Use of the SH7294 allows easy and speedy development of sophisticated next-generation camera-equipped mobile phone systems, and moreover fast and efficient software development is also facilitated by a development platform and comprehensive middleware.
Mobile phones now support a wide variety of sophisticated applications, including game and moving pictures distribution. At the same time, development of mobile phone system has become more complex, requiring increased development time and cost, and it has become difficult to release new models in a timely manner in line with ever-shorter model-change cycles in the Japanese market. In response to these problems, Hitachi developed the SH-Mobile Series, with a high-speed application processing LSI provided separately from the baseband LSI that performs communication processing, and released the first-phase product SH7290 to high acclaim from the market. A conspicuous feature of the current market is the growing popularity of mobile phones with a built-in camera, and the future trend will be one of ever higher functionality, including larger screen sizes, with a VGA (640 480 pixels) camera imaging size, for example, together with more versatile display capabilities.
By this background Hitachi is releasing the SH7294 as the second-phase product in the SH-Mobile Series, featuring enhanced camera-support and display functions to meet the needs of next-generation camera-equipped mobile phones. The SH7294 incorporates a SH3-DSP CPU core which is one of SuperH family and is suitable for digital still cameras and similar multimedia portable devices, and offers an operating frequency of 120 MHz. Features of the SH7294 are summarized below.
The package used for the SH7294 is a small CSP-225 (10 mm 10 mm, 0.5 mm pin pitch, 1.4 mm thick).
Also being released is the HJ93D1705BP MCM incorporating an SH7294 and 1-Mbyte SRAM stack-mounted in a package of same size (10 mm 10 mm, 0.5 mm pin pitch, 1.4 mm thick), for greater space saving.
Use of these two new products will enable speedy, low-cost, and space-saving development of next-generation mobile phone systems incorporating a camera function. They will also make it possible to respond rapidly to the need for application development or modification associated with future service diversification or changes in service contents.
Hitachi will continue to develop and release products that meet the needs of successive generations of mobile phones, in line with the ever-increasing sophistication of mobile phone systems.
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|Information contained in this news release is current as of the date of the press announcement, but may be subject to change without prior notice.|
|WRITTEN BY Corporate Communications Division