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Corporate InformationResearch & Development

June 25, 2014

Report from Presenter

The 64th Electronic Components and Technology Conference (ECTC 2014) was held in Florida, USA from May 27 to 30. This meeting is the premier international conference about packaging technology for electronics components and devices. About 1,170 people, who are technical experts and university researchers from 33 countries, attended this meeting in this year.

Hitachi's Yokohama Research Laboratory made an interactive presentation entitled "Study on Prediction about Residual Position of Void Generated by Resin Flow."

In resin molding process, when air voids that are generated by a resin flow during a molding process remain in the molded products, crack and separation that started from the air voids occur. There is a problem to have to repeat trial manufacture to choose a product shape and a molding condition and the material that do not let air voids remain (Fig. 1). Therefore a flow analysis technique to predict outbreak and movement of the air voids in the resin molding process was developed.

Fig. 1 Objective of resin molding analysis

Fig. 2 Overview of resin molding analysis

The characteristic of this analysis technology is to predict outbreak and movement of the voids by cooperation analysis of gas-liquid two-phase analysis to predict outbreak of the voids at the electrode neighborhood and the movement analysis of the particles that simulated voids (Fig. 2).

This cooperation analysis is comprised of three following steps.

Step1: We input the properties of material and the molding conditions and the product shape, and we calculate flow velocity of the resin.

Step2: We calculate a void volume by gas-liquid two-phase flow analysis using the flow velocity that we calculate in step 1 as boundary condition.

Step3: We set the particles as simulated air voids that we calculated in step 2, and we calculate the movement position of the air voids.

By this technique, an appropriate material property for a product shape and a molding condition becomes able to be examined by simulation before trial production.

In Yokohama Research Laboratory, we utilize such an analysis technology to resin mold and contribute to achieve high performance and high reliability of the resin molded products.

(By MINO Masayuki)

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