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Hitachi Research & Development

Hitachi

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Aiming to attain both energy saving and a comfortable lifestyle, research on new energy-control devices, i.e., system power devices (or high-voltage semiconductors), for enhancing performance of power electronics systems, and research on their control technologies, is advancing. Microcomputers are the brain, while power devices are the heart and will become ever more important as key devices.

Power devices are high-voltage semiconductors for on/off control of voltages from several tens of volts to several kilovolts and currents from several milliamperes to several kiloamperes. They are switching devices like IGBTs and power MOSFETs, and high-voltage ICs, and modules which combine them. They are widely used in inverters for driving motors in trains, hybrid electric vehicles (HEVs), household appliances, etc., power supplies for PCs, and driver ICs for driving the pixels of flat-screen TVs.
By overviewing whole system and focusing on low-loss, compact, and high-performance devices, we are aiming to create energy-saving products and devices that are easy on the environment.

  • M. Mori et al: "A Trench-Gate High-Conductivity IGBT(HiGT) With Short-Circuit Capability," IEEE Electron Devices, vol. 54, no. 8, pp. 2011-2016, Aug. 2007.
  • M. Mori et al: "A Planer-Gate High-Conductivity IGBT(HiGT) With Hole-Barrier Layer," IEEE Electron Devices, vol. 54, no. 6, pp. 1515-1520, June 2007.
  • T. Hashimoto, et al., "Advanced Power SiP with Wireless Bonding for Voltage Regulator," ISPSD Proceedings, May 2007, pp. 125-128.
  • N. Sakurai et al: "A 1200V high-power driver IC with multi-chip mounting for strong HEVs," SIA2007 Proceedings
  • M. Shiraishi et al: "Low Loss and Small SiP for DC-DC Converters," ISPSD Proceedings, May 2005, pp. 175-178.
  • K. Hara et al: "A New 80V 32x32ch Low Loss Multiplexer LSI for a 3D Ultrasound Imaging System," ISPSD Proceedings, May 2005, pp. 359-362.
  • M. Inaba et al: "Sub-System Power Module for a 42V Motor Generator System", ISPSD Proceedings, May 2004, pp. 173-146.