We are moving forward with R & D on advanced metal plating technology to support semiconductor device fabrication.
We are applying tools such as nano-scale reaction analysis and plating techniques to the formation of semiconductor element wiring and third-generation device nano-scale structures.
Various kinds of electronic equipment such as personal computers and car navigation systems incorporate Hitachi's high-speed, large integration scale semiconductor devices (LSI, etc.). The functions of the LSI chips are realized by connection to memory devices, a power supply and other components on a printed wiring board. These various types of devices involve wiring that has dimensions ranging from 50 nm to 100 mm.We are applying metal plating technology as a method of forming the wiring.
The nano-devices of the next generation will require easy formation of nano-scale structures, so we are pushing the development of nano-plating technology.
Plating technology for forming fine structures will be useful in a number of fields, including biology, information technology, and energy. Hitachi is challenging the most advanced R & D in plating technology.
