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HITACHI REVIEW

Volume 44 Number 2
April 1995

Featured Articles

<Production Equipment for Next Generation Electronic Devices>

Trends in Semiconductor Device Production Lines and Processing Equipment

Atsuyoshi Koike and Masayasu Tsunematsu

High-Throughput Electron Beam Lithography System

Hiroyuki Ito, Gen'ya Matsuoka, and Norio Saito

Electron Beam Direct Writing Technologies for the HL-800D

Fumio Mizuno and Fumio Murai

Microwave Plasma Etching Equipment for 200-mm Diameter Wafers

Naoyuki Tamura, Kazuo Nojiri, Kazunori Tsujimoto, and Kazue Takahashi

High-Performance No-Damage Ozone Asher

Akio Inada, Tetsuya Takagaki, and Teruki Suzuki

High-Throughput Single-Wafer Thermal Process System

Fumihide Ikeda, Toshiyuki Uchino, and Tomoshi Watanabe

Inspection and Analysis System for Wafer Pattern Defects

Seiji Ishikawa, Isao Miyazaki, and Osamu Sato

Observation and Measurement of Microstructures Using a High-Energy Scanning Electron Microscope

Hideo Todokoro and Fumio Mizuno

Critical Dimension Measurement Scanning Electron Microscope for ULSI (S-8000 Series)

Tadashi Otaka, Hiroyoshi Mori, Osamu Yamada, and Hideo Todokoro

All Rights Reserved, Copyright (C) 1995, Hitachi, Ltd.