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HITACHI REVIEW

Hitachi

e-Manufacturing System for Next-generation Semiconductor Production

AUTHORS

Yasutsugu Usami Products Marketing Dept., Device Manufacturing Systems Business Gr., Hitachi High-Technologies Corporation
Isao Kawata Process Control Systems Sales 3rd Dept., Semiconductor Process Control Systems Sales Div., Hitachi High-Technologies Corporation
Hideyuki Yamamoto Semiconductor Equipment Design Dept., Kasado Div., Hitachi High-Technologies Corporation
Hiroyoshi Mori Electronics Systems Design Dept. 1, Naka Div., Hitachi High-Technologies Corporation
Motoya Taniguchi, Dr. Eng. R&D Promotion Dept., Group Strategy Div., Hitachi High-Technologies Corporation

OVERVIEW

Next-generation semiconductor factories need to support miniaturization below 100 nm and have higher production efficiency, mainly of 300-mm-diameter wafers. Particularly to reduce the price of semiconductor devices, shorten development time [thereby reducing the TAT (turn-around time)], and support frequent product changeovers, semiconductor manufacturers must enhance the productivity of their systems. To meet these requirements, Hitachi proposes solutions that will support e-manufacturing on the next-generation semiconductor production line.

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RELEVANT SITES

open in new window Device Manufacturing Equipment
open in new window Kasado Division, Semiconductor Equipment Design Dept.
open in new window The Hitachi Hyoron (Japanese Only)

KEYWORDS

e-Manufacturing, OEE, EES, APC, e-Diagnostics

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