| Takafumi Tokunaga | Process Development Dept., Semiconductor Technology Development Div., Device Development Center, |
| katsutaka Kimura | ULSI Research Dept., Central Research Lab., |
| Jun Nakazato | Process Factory Automation Dept., Production Engineering Research Lab., |
| Fumiyuki Kanai | Production Technology Sect., Production Technology Div., Semiconductor Gr., |
Hitachi is actively working on the miniaturization and standardization of CMOS (complementary metal-oxide semiconductor) devices and on the establishment of a CMOS platform. This will enable Hitachi to share IP (intellectual property), a design asset. Furthermore, in conjunction with this platform, Hitachi will develop core devices other than CMOS devices and combine rich IP to provide customers with system-on-a-chip products as an optimal solution. Hitachi is adopting an APC (advanced process control) technology to reduce variation in its process and manufacturing technologies. It also aims to support the production of a small volume of many products and to respond quickly to market and customer needs, especially through the full single-wafer processing line for 300-mm wafers at Trecenti Technologies, Inc. (TTI).
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The Hitachi Hyoron (Japanese Only) |
Semiconductor, CMOS platform, system-on-a-chip, process technology, 90 nm
