Hitachi Review

‘Best Solutions’ for Production of Leading-edge Semiconductor Devices

Volume 51 Number 3 October 2002

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Hitachi

Hitachi Review

Featured Articles

e-Manufacturing System for Next-generation Semiconductor Production
Yasutsugu Usami / Isao Kawata / Hideyuki Yamamoto / Hiroyoshi Mori / Motoya Taniguchi, Dr. Eng.
Semiconductor Process and Manufacturing Technologies for 90-nm Process Generation
Takafumi Tokunaga / Katsutaka Kimura / Jun Nakazato / Fumiyuki Kanai
UHF-ECR Plasma Etching System for Gate Electrode Processing
Shinji Kawamura / Naoshi Itabashi / Akitaka Makino / Masamichi Sakaguchi
Hitachi's Slimming System Using Ozone Process Technology
Hiromichi Kawasaki / Sukeyoshi Tsunekawa / Hiroshi Kawakami / Norio Hasegawa
Vertical SiGe Epitaxial Growth System
Yasuo Kunii, Dr. Eng. / Yasuhiro Inokuchi / Akihiro Miyauchi, Dr. Eng.
Advanced Process Control for Semiconductor Thermal Process
Mitsuhiro Matsuda / Toshimitsu Miyata / Masakazu Shimada / Tomoji Watanabe
High-current Ion Implanter for 300-mm SIMOX Wafer Production
Kazuo Mera / Hiroyuki Tomita / Katsumi Tokiguchi, Dr. Eng.
Semiconductor Yield Enhancement Solutions for Next Generation
Yasutsugu Usami / Naoyuki Eguchi / Seiji Isogai
New CD-SEM System for 100-nm Node Process
Osamu Nasu / Katsuhiro Sasada / Mitsuji Ikeda / Makoto Ezumi
In-line Atomic Force Microscope for Semiconductor Process Evaluation
Hirokazu Koyabu / Ken Murayama / Yukio Kembo / Sumio Hosaka, Dr. Eng.
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