Hitachi Review

Nanoscale Imaging, Material Removal and Deposition for Fabrication of Cutting-edge Semiconductor Devices

—Ion-beam-based Photomask Defect Repair Technology—

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Hitachi

Hitachi Review

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FIB technology is applied to repair defects in lithography photomasks used in semiconductor device fabrication. Cutting-edge devices demand nanometer-scale minimum processing dimensions and precision for defect repair. To meet these scaling requirements, Hitachi has developed a novel gas field ion source. This breakthrough scaling technology replaces liquid metal ion sources, an area in which Hitachi has over 30 years of experience. It has been implemented into a defect repair system to confirm that it satisfies cutting-edge performance requirements such as minimum processing dimension, repair precision, and post-repair photomask optical properties.

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ABOUT THE AUTHORS

Anto Yasaka, Ph.D.

Electron Microscopes Systems Design 1st Department, Science & Medical Systems Business Group, Hitachi High-Technologies Corporation. He is currently engaged in the development and design of electron microscope systems and FIB systems. Dr. Yasaka is a member of the Japan Society of Applied Physics (JSAP).

Fumio Aramaki

Beam Technology Product Design Department, Hitachi High-Tech Science Corporation. He is currently engaged in the development and design of FIB mask repair systems.

Tomokazu Kozakai

Beam Technology Product Design Department, Hitachi High-Tech Science Corporation. He is currently engaged in the development and design of FIB mask repair systems.

Osamu Matsuda

Beam Technology Product Design Department, Hitachi High-Tech Science Corporation. He is currently engaged in the development and design of FIB mask repair systems.

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