Hitachi Review

Coating Thickness Measurement with High-performance for Latest Electronic Fine Components of Mobile Devices

—FT150 Series Fluorescent X-ray Coating Thickness Gauge—

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X-ray fluorescence analysis is widely used for measuring the coating and plating film thickness of electronic components and other products as it can perform non-destructive and non-contact simultaneous measurement of multi layer coatings. As the components to be measured become increasingly scaled-down, the X-rays used for this purpose need to be tightly focused. The FT150 series high-performance fluorescent X-ray coating thickness gauge meets this requirement. It realizes nanometer-level plating thickness measurement over an area of several tens of microns, by using polycapillary X-ray focusing devices, in place of the conventional collimator method, thereby increasing the intensity of X-rays to which the sample is exposed by around 1,000 times. This article introduces some typical applications to describe the measurement precision performed by the FT150 series.

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ABOUT THE AUTHORS

Haruo Takahashi

Analytical Instruments Design Department, Hitachi High-Tech Science Corporation. He is currently engaged in the development of XRF analysis systems.

Masaki Izumiyama

Analytical Application Engineering Department,Hitachi High-Tech Science Corporation. He is currently engaged in the development of XRF analysis applications. Mr. Izumiyama is a member of The Japan Society for Analytical Chemistry (JSAC).

Ryusuke Hirose, Dr. Eng.

Analytical Instruments Design Department, Hitachi High-Tech Science Corporation. He is currently engaged in the development of XRF analysis systems. Dr. Hirose is a member of The Japan Society of Applied Physics (JSAP).

Toshiyuki Takahara

Analytical Instruments Design Department, Hitachi High-Tech Science Corporation. He is currently engaged in the development of X-ray inspection systems.

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