—FT150 Series Fluorescent X-ray Coating Thickness Gauge—
X-ray fluorescence analysis is widely used for measuring the coating and plating film thickness of electronic components and other products as it can perform non-destructive and non-contact simultaneous measurement of multi layer coatings. As the components to be measured become increasingly scaled-down, the X-rays used for this purpose need to be tightly focused. The FT150 series high-performance fluorescent X-ray coating thickness gauge meets this requirement. It realizes nanometer-level plating thickness measurement over an area of several tens of microns, by using polycapillary X-ray focusing devices, in place of the conventional collimator method, thereby increasing the intensity of X-rays to which the sample is exposed by around 1,000 times. This article introduces some typical applications to describe the measurement precision performed by the FT150 series.
Analytical Instruments Design Department, Hitachi High-Tech Science Corporation. He is currently engaged in the development of XRF analysis systems.
Analytical Application Engineering Department,Hitachi High-Tech Science Corporation. He is currently engaged in the development of XRF analysis applications. Mr. Izumiyama is a member of The Japan Society for Analytical Chemistry (JSAC).
Analytical Instruments Design Department, Hitachi High-Tech Science Corporation. He is currently engaged in the development of XRF analysis systems. Dr. Hirose is a member of The Japan Society of Applied Physics (JSAP).
Analytical Instruments Design Department, Hitachi High-Tech Science Corporation. He is currently engaged in the development of X-ray inspection systems.
