1. Semiconductor Device Trends and Diversifying Customer Needs in the IoT/AI Era
As the Internet of Things (IoT) is steadily advancing, various types of things are being connected to the Internet including industrial equipment, home appliances, and vehicles in addition to PCs and smartphones. A number of different semiconductor devices are required to advance the IoT, one of which is an edge device such as a sensor, and another is a high-performance device that stores and processes large volumes of collected data on servers and data centers.
As for high-performance devices, advanced logic devices, dynamic random-access memory (DRAM), and NAND flash memory are needed. The feature sizes of these devices will continue to shrink, and device structures will continue to become three dimensional in the years ahead. In order to realize these devices, precise processing of devices with small features and complex structures is required. Inspection technologies with rapid detection of problems in manufacturing processes and equipment are also needed. As for edge devices, a wide range of sensors and communication devices are demanded. For manufacturing these edge devices, production volume at 200-mm wafer fabs will increase in addition to existing 300-mm wafer fabs since advanced process technology is not required for manufacturing these edge devices. At 200-mm wafer fabs, manufacturing technology is already established, and there is a growing need for replacement of existing equipment due to performance deterioration, and productivity improvements by automation and throughput improvement.
Hitachi will continue to provide technologies and solutions that meet diversifying customer needs.
(Hitachi High-Technologies Corporation)