1. Trends in Advanced Semiconductor Devices and Customer Requirements for Manufacturing and Inspection Equipment
As payments and other applications for processing information using smartphones become more widespread and the Internet of Things (IoT) continues to grow, the amount of data being generated and processed is expanding dramatically. Meanwhile, the spread of 5th-generation (5G) telecommunications and the rollout of autonomous driving are expected to increase the quantity of this data even further. As advanced logic and memory devices are used to process this huge amount of data and utilize it for prediction and decision making, demand for these advanced devices is predicted to grow.
In logic devices and in dynamic random-access memory (DRAM), further miniaturization of device size continues along with the structural transition [from fin field effect transistors (FinFETs) to gate-all-around (GAA) transistors in logic devices]. As for three-dimensional (3D-) NAND flash memory in which memory cells are vertically stacked, higher bit density is achieved by increasing the number of stacked layers. Devices with 96 layers are already in production and those with more than 200 layers are in the pipeline. In the development and manufacturing of these advanced semiconductor devices, technologies that can fabricate these complex structures with high precision are required as well as the inspection and measurement technologies for controlling these processes. The inspection of the backside of wafers is also necessary because backside control is important for manufacturing these advanced devices with high yield.
Hitachi will continue to supply technologies and solutions to meet these diverse customer requirements.
(Hitachi High-Tech Corporation)