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Key Materials for Electronic Information and Communication Equipment |
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AUTHORS |
| Atsushi Fujioka |
Electronic Materials Business Strategy Dept., Electronic Materials Business Sector, Hitachi Chemical Co., Ltd. |
| Kazumasa Osono |
Optical Transmission Parts Unit, Photonics Research & Development Center, Research & Development Gr., Hitachi Cable, Ltd. |
| Yuju Endo |
Conductor & Composite Materials Unit, Materials Technology Research & Development Center, Research & Development Gr., Hitachi Cable, Ltd. |
| Haruo Akahoshi |
Dept. of Electronic Materials and Devices Research, Materials Research Lab., Hitachi Research Lab., Hitachi, Ltd. |
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OVERVIEW |
Electronic information and communications are fundamental to the basic infrastructure of modern society. Today's advanced information society is built upon networked layers of transistors fabricated on silicon wafers and other semiconductor substrates. LSIs are fabricated by networking billions of transistors on a wafer, and CPU modules and other advanced capabilities are achieved by interconnecting LSIs to the outside devices. It is through this building-block approach that the PCs and other electronic products we use every day are constructed. In building up this network, advanced materials are critically involved in everything from the fabrication of LSIs to the implementation of optical communications. Anticipating these needs, Hitachi is striving to be a global leader in the research, development, and marketing of advanced highly functional materials products.
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TO READ THIS ARTICLE |
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RELEVANT SITES |
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KEYWORDS |
CMP slurry, die bonding film, printed circuit board, metal cable, optical cable, flexible flat cable, planar lightwave circuit, holey fiber
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