| Kunihiko Nishi | Assembly Engineering Dept., Total Production Div., Semiconductor & Integrated Circuits, |
| Munehisa Kishimoto | Package Engineering Development Dept., Multi-Purpose Semiconductor Business Div., Semiconductor & Integrated Circuits, |
| Kunio Kobayashi | Komoro Development and Engineering Center, Multi-Purpose Semiconductor Business Div., Semiconductor & Integrated Circuits, |
| Takashi Akazawa | Multi Chip Module Products Design Dept., DRAM Business Div., Semiconductor and Integrated Circuits, |
| Toshihiko Sato | Assembly Process Development Dept., Assembly Technology Development Operation, Semiconductor and Integrated Circuits, |
The network era of the 21st century requires that both desktop-type equipment and mobile equipment be connected to networks for the exchange of data and information. Improvements to hardware, in the form of higher speeds of data transmission and information processing, will be required. Furthermore, higher-density assembly and lower levels of power consumption will be called for to realize lighter and more compact mobile equipment. Consequently, the semiconductor assembly technology for such equipment will not be the conventional surface mounting technology. Hitachi has been focusing on the development of a new assembly technology to meet these needs.
 |
The Hitachi Hyoron (Japanese Only) |
HPA(High Power Amplifier), CSP(Chip Scale Package), MCM(Multi Chip Package), 3D Packaging Technology, System Package
