| Masakazu Shimada | Vertical Equipment Design & Engineering Dept., Toyama Works, |
| Mitsuhiro Hirano | Vertical Equipment Design & Engineering Dept., Toyama Works, |
| Takahiro Maeda | Mass Production Process Development Dept., Toyama Works, |
| Jie Wang | Development Dept.I, Semiconductor Equipment System Lab., |
In regard to recent patterns in semiconductor fabrication, two features are clear: mass production of a few product varieties, such as DRAMs and MPUs, or small amount production of many product varieties, such as system LSIs. From now onwards, however, demands for shortening the fabrication period will grow. In the case of large batches (processing 100 to 125 wafers), the standby time needed for output adjustment gets longer, thereby lengthening the fabrication period significantly. Moreover, on top of increases in gas generation and power consumption, it is also a problem that the quantity of dummy wafers consumed in making up for several defective wafers also increases, and the CoO rises dramatically. In response to these challenges, aiming at higher productivity, Hitachi Kokusai Electric Inc. has developed a vertical-type diffusion and CVD tool—called "QUIXACE"—for handling "quick turnaround time" with good process performance at high throughput. With this tool, we will further contribute to improving the production of semiconductor devices.
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Hitachi Kokusai Electric Inc. |
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The Hitachi Hyoron (Japanese Only) |
vertical, furnace, diffusion, CVD, QUIXACE
