Hitachi, Ltd. (TSE: 6501) today announced the HB52RD168GB Series of 144-pin Micro
DIMMs*1, offering an industry-first 128-Mbyte capacity, for use as expansion memory in
sub-notebook PCs. Sample shipments will begin in April 2000 in Japan.
This new series employs the world's smallest class of 64-Mbit synchronous DRAMs
(SDRAMs) and TCP*2 stacked-mounting technology with two TCPs to achieve the first
Micro DIMMs with a 128-Mbyte capacity. Also being released are PC100 compatible
64-Mbyte HB52D88GB Series and 32-Mbyte HB52D48GB Series, with the same date of
April 2000 for initial sample shipments in Japan.
With the recent explosive growth in memory capacity requirements for PC operating
systems and application software, large main and expansion memory capacities have also
become essential for sub-notebook PCs. At the same time, the demanding space-saving
requirements of sub-notebook PCs have led to the release of miniaturized 144-pin Micro
DIMMs (external dimensions: 38.0 mm ¡ß 30.0 mm, ¡ß 3.8 mm) which is about 2/3
surface area of SO DIMMs*3 (external dimensions: 67.6 mm ¡ß 25.4 mm, ¡ß 3.8 mm).
Following on from the previously released PC66-compatible 64-Mbyte and 32-Mbyte
Micro DIMMs, Hitachi has now developed the HB52RD168GB Series of 128-Mbyte
Micro DIMMs to meet the demand for greater capacity.
In the new series, the use of 64-Mbit SDRAMs with a chip size of 38 mm2-the world's
smallest class?and proprietary TCP stacked-mounting technology with two TCPs has
made it possible to mount a total of 16 chips on the two board surfaces, and so achieve
the industry's first 128-Mbyte MicroDIMM.
The concurrently released 64-Mbyte HB52D88GB Series incorporates four DDPs*4 with
two 64-Mbit SDRAM chips stacked as 128-Mbit SDRAM, while the 32-Mbyte
HB52D48GB Series uses four 64-Mbit SDRAMs.
These three series all feature a ¡ß64-bit configuration, 3.3 V power supply voltage, and
PC100 (CAS Latency : 2, 3 ) compatibility, and low-current specification products are
also available, for a total of 12 models with various combinations of features. The pin
arrangement is identical to that of 144-pin SO DIMMs, but the pin pitch has been
decreased to 0.5 mm.
Future plans include the development of even larger-capacity 256-Mbyte models, and
also dual-bank models offering lower power consumption.
Notes: 1. DIMM: Dual Inline Memory Module
2. TCP: Tape Carrier Package
3. SO DIMM: Small Outline Dual Inline Memory Module
4. DDP: DDP is short for the Double Density Package (with two chips mounted
¡¡¡¡¡¡¡¡¡¡¡¡¡¡¡¡ in a single TSOP package)
< Typical Applications >
¡¦ Expansion memory or main memory for sub-notebook PCs
< Prices in Japan > (For Reference)
Part Number Memory Capacity Sample Price (Yen)
HB52RD168GB Series 128 Mbytes 39,000
HB52D88GB Series 64 Mbytes 15,600
HB52D48GB Series 32 Mbytes 8,400
< Specifications >
Item | HB52RD168GB Series | HB52D88GB Series | HB52D48GB Series |
Memory capacity | 128 Mbytes | 64 Mbytes | 32 Mbytes |
Bit configuration | 16 M¡ß64 | 8 M¡ß64 | 4 M¡ß64 |
Bank configuration | 1 bank | 1 bank | 1 bank |
Operating frequency | PC100 (CL= 2, 3 ) | PC100 (CL= 2, 3 ) | PC100 (CL= 2, 3 ) |
Power supply voltage | 3.3V+/- 0.3V | 3.3V+/- 0.3V | 3.3V+/- 0.3V |
Operating current (Icc1) | 960 mA | 480 mA | 260 mA |
Standby current (Icc2ps) | 16 mA | 8 mA | 4 mA |
Package | 144-pin MicroDIMM | 144-pin MicroDIMM | 144-pin MicroDIMM |
External dimensions | 38.0 mm¡ß30.0 mm¡ß3.8 mm | 38.0 mm¡ß30.0 mm¡ß3.8 mm | 38.0 mm¡ß30.0 mm¡ß3.8 mm |
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