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December 11, 2015
Hitachi Developed Ceramic Package Substrate to Enhance Data Processing Capability Ten Times Greater in Information Technology Equipment
Hitachi, Ltd. and Hitachi Metals, Ltd. have developed the LTCC (Low Temperature Co-fired Ceramics) package substrate with 2 µm line and space re-distribution layer (RDL). Compared with current package substrate LTCC package substrate has achieved more than ten times of data processing capability by connecting LSI dies with memory dies by more than 1,000 fine lines. Furthermore, the capability of high reliability and low cost of this package substrate compared with the organic package substrate with silicon interposer are also shown.
Hitachi is committing to promote further low cost in LTCC package substrate in order to make contributions of building social infrastructure with safety and comfort.
Structure and fine line of developed LTCC package substrate