1. NX5200: FIB-SEM System Enabling High-precision, High-throughput Analysis of Cutting-edge Devices
The use of three-dimensional (3D) structures and new materials in cutting-edge devices has recently been gaining ground along with increasing miniaturization. As a result, detailed physical analysis is becoming increasingly important in addition to in-line inspection and measurement. When analyzing specific locations in cutting-edge devices, it is essential to use a focused ion beam and scanning electron microscope (FIB-SEM) system to prepare the sample and use a transmission electron microscope (TEM) for the observation and measurement.
Designed in response to user feedback on previous models, the NX5200 analysis system greatly reduces TEM sample preparation time and saves labor by automated processing. Processing endpoints can be checked with the same high-resolution observation provided by previous models. The improved low-acceleration voltage FIB observation performance makes it easy to set processing positions when preparing TEM samples. Navigation functions used to identify locations have been enhanced to enable rapid processing settings, ensuring analysis is highly accurate while maintaining high throughput. User requests for further reductions in labor and manpower will be met by raising the automation rate, increasing speed, and improving the success rate and accuracy of automated functions.
(Hitachi High-Tech Corporation)