1. Target Material for Highly Corrosion-resistant Molybdenum Alloy Film Supporting Flexible Substrates
Hitachi Metals, Ltd. manufactures and sells target materials used for sputtering, a thin film production method. Demands for smaller, lighter, and higher-functionality electronic devices are resulting in production of thinner films, and in the future, there will also be demands for flexible films offering superior portability.
The company has developed a new target material for forming molybdenum alloy (MVF-5X) film. The material provides a number of properties to support multiple applications. It has the high corrosion resistance needed for the coming generation of high-functionality thin-film devices. It also has high adhesion and low stress on flexible substrates such as resin films, along with a thermal diffusivity barrier property when used with high-functionality films such as conductive or magnetic films.
The new material has been released in applications such as the surface protection film (cap film) of copper wiring in liquid crystal displays (LCDs), and has been slated for mass-production by some customers. Hitachi Metals is promoting the material to customers and taking sample orders in anticipation of a switch to laminated thin films for electronic parts currently being manufactured by powder sintering. The company is also working on releasing thin films made from the new material for applications in areas such as design. These thin films provide the same high optical reflection characteristic as chromium, along with oxidation resistance high enough to retain a metallic gloss in air at 350°C.
(Hitachi Metals, Ltd.)
[1] Metal films after heating in air (film thickness: 0.2 µm)